Dr. Douglas C. Hopkins
Education:
Ph.D. in Electrical Engineering, 1989, Virginia
Polytechnic Institute and State University (and VPEC)
BSEE, MSEE in Electrical Engineering,
State University of New York at Buffalo
Expert Witness - Litigation History click here
Consulting History:
(DCHopkins&Associates, LLC since 1989)
2009 Emerson Motor Company, St. Louis, MO
2008 Renewable Energy Development Inc., Oneonta, NY
2006-07 Emerson Climate Technologies, Sidney. OH
2005 Eaton Aerospace, Grand Rapids, Michigan
2005-09 Kevin Kennedy & Associates, Indianapolis, Indiana
2004 Yazaki North America, Canton, Michigan
2003 Emerson Ridge Tool Company, Elyria, OH
2003-04 Astec Power Andover, MA
2002-03 Celestica Power, Milwaukie, OR
2002-03 Precision Magnetic Bearings Inc., Albany, NY
2001 Emerson Motor Division, Cleveland, Ohio
2000-01 Systel Development and Industries, Ltd.,Israel
2000 Verizon Communications, Inc., NY
1999-00 Grundfos A/S, Bjerringbro, Denmark
1998-00 JRS Technology Inc., Endicott, NY
1997-98 ENI Power Systems, Rochester, NY
1996-98 Custom Electronics Inc., Oneonta,NY
1995-01 Varity Zecal Inc., Churchville, NY
1995-97 Lawrence Livermore National Laboratories
1992-98 Power Technology Services, Raleigh, NC
1992 Marconi Circuits Technology, Farmingdale,NY
1991-96 BrushWellman Inc., Cleveland, OH
1991 Micon Engineering, College Station, TX
1989-93 Power Tech, Fair Lawn, NJ
1988-89 Digital Equipment Corp., Burlington, VT
Summer
Appointments:
1995: Visiting Scientist, Power Conversion
Thrust Area Lawrence Livermore National Laboratories, Livermore, California
1994: US Army Visiting Faculty, TECOM - MITRE
Corporation, Ft. Huachuca, AZ
1993: Visiting Faculty Fellow, Ohio Space Institute
NASA Lewis Research Center, Cleveland Ohio
1992: NASA/ASEE Faculty Fellow, Power Technologies
Directorate NASA Lewis Research Center, Cleveland Ohio
1991: NASA/ASEE Faculty Fellow, Power Technologies
Directorate
NASA Lewis Research Center, Cleveland Ohio
1990: NASA Faculty Fellow, Electrical Power
Branch NASA Marshall Space Flight Center, Huntsville, Alabama
1989: Visiting Faculty Researcher, Pulse Power
Technology Branch US Army LABCOM-ETDL, Ft. Mammouth, New Jersey
Positions:
1983-present President, DCHopkins & Associates, LLC
2011-present Research Professor, Dept. of Electrical and Computer Engineering, North Carolina State University, Raleigh, NC 919.473.3773
1997-2012 Research Professor, Dept. of Electrical Engineering Department, State University of New York at Buffalo, New York
1989-98 Assistant Professor, Dept. of Electrical
Engineering, State University of New York at Binghamton, and Auburn University,
Alabama
1983-88 Instructor/Ph.D. Student, Dept. of Electrical Engineering, Virginia Polytechnic Institute and State University, Virginia
1982-83 Electrical Engineer, Corporate R&D
Center, Carrier Corporation, Syracuse, New York
1977-82 Senior Engineer, Research and Development
Center, General Electric Company, Schenectady, New York
Publications:
Dr. Hopkins has over 50 referred technical publications
in conferences and journals, and various awards. (See www.dchopkins.com for complete list.)
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Providing technology innovation and
management in Power Electronics and Electronic Energy Systems
Technology
Management
Visionary - Participation and leadership on international road-mapping
studies by the PSMA (developed the road-mapping framework for power packaging,
assisted in power integration), founded and chaired four technical-society
subcommittees to focus on high density power electronics systems, served
as consultant to corporate marketing groups.
Program Development - Defined and proposed over $7M in government
support for private companies, established three university r&d laboratories
and served as consultant to corporate engineering. Accomplished in articulating
technical requirements, determining program structure and creating funding
proposals for industrial clients.
Project Management - Directly managed projects up to $1.4M having industrial team involvement. Company president for two Phase-I SBIR grants and one Phase-II. Experienced with acquiring and supervising professional personnel in an
ethnically diverse environment.
Technology Innovation
Development of firsts in
power electronic packaging: off-line converter >60W/in2,
3D MOSFET module for avionics.
power electronic circuits: inductive battery-charge equalizer
and family of re-circulating energy circuits.
SiSC-based Solid State Circuit Breakers: for >350o operation in aerospace and military applications.
continued involvement in R&D: in electrical design and high-density
systems through university and SBIR funding (Phase I&II grants).
providing Professional Development Seminars in power electronic systems
and packaging, e.g. IEEE-APEC, IMAPS and WESCON
More projects listed below
Sample Projects:
Advanced development of an ultra high density shunt regulator
for avionics application
Developed a 3-D GlidCop’ package for power MOSFETs, drivers
and control circuit
Worked directly with manufacturing to develop design prototypes
Client was Martin Marietta, now BAE
Advanced development of a high density Zero-Current-Switched
Quasi-Resonant Converter.
Developed first 2MHz, 100W, offline 465V:5V converter
(power section) at >60W/in2.
Developed a >2mil cermet conductor fabrication process for
converter
Performed finite difference thermal analysis.
Client's representative in technical investigation of field-prototype
failures
Client's customer was in final design verification and having
fatal field prototype failures in a boat ignition and battery charging
system
Simulated a multi-output asynchronously switched thyristor
regulator system and demonstrated a fundamental design flaw
Recommended design changes in the electrical and physical
circuit
Client's customer was largest USA-based marine engine producer
Proposed and co-developed high-voltage-3kV, high-temperature-240°
C power module.
Developed high temperature component tests.
Designed a kV-kA self-resonant capacitor tester. (A new technique.)
Integrated thermal models into SPICE.
Technology development in electronic lighting ballasts
Teamed with an industrial partner to propose and win a $488K New York State (NYS) contract.
Program director for lighting ballast development using an integrated digital controller IC
Teamed with associate and Dir. of Mfg. to develop the next generation of lighting ballasts
Wrote the proposal with an industrial partner to win a $1.3M DOE/NYS contract.
Worked with a device manufacturer to characterize and apply
next generation IGBT/MCT devices.
Developed a simplified high-performance, constant current
gate driver (constant 30 A in 200 ns with 0.4kV/m s miller voltage rejection
to 150 V).
Designed a laboratory test system for a pulsed power thyristor
(world’s fastest); with capability to 110kA/m s. Included LabView control,
data capture and analysis, and TDR measurement of package inductance.
Invented a class of converters for energy storage and re-circulation.
Provides a unifying approach to energy-pump circuits and
predicted several new topologies. Applicable to power factor correction,
current drive circuits, battery equalization, etc.
Invented the inductive-based active battery equalization
techniques
On-site continuing education courses in Power Electronic
Systems and Packaging.
Dr. Hopkins is a recognized expert in integrated electrical/physical
power electronics design. He is a professional educator with a contemporary
presentation style offering continuing education to the engineers of industry.
Other Projects:
DC Hopkins was the principal/co investigator
in the following (dollars indicate project size). The *
indicates as noted in above description.
"Laboratory Development - Packaging Research in Electronic Energy Systems" NC State University, $633K
"Workforce Training for the Electric Power Sector" Florida Power & Light Company, $300K
"Intelligent, Fault Tolerant, and Robust SSPC for Aircraft Applications" US Navy $148,806
"Multi-Institutional Curriculum Development and Delivery to Create the New Smart Grid Workforce" Dept of Energy, $400K
"High Reliability SiC Power Switch Module Packaging" US Air Force, $749,846
"Development of a FREEDM Systems Energy Packaging Initiative" Future Renewable Electric Energy Delivery Management (FREEDM) Center, $31,134
"Study in the Area of Plug Hybrid Electric Vehicles" National Grid US, $21,300
"Advanced Power Electronics For Mobile Electric Power" US Army, $54,204
"High Reliability SiC Power Switch Module Packaging" Secretary of Defense, US Air Force, $99,376 (UB $20K)
"Metrology Development for Large Area Ceramics" ENrG Corporation, $56,315
"Advanced SiC Converter for Embedded Applications" Naval Research Laboratory, $69,939
"SiC Module development" under present development, $119K
"Component and Systems Development for Power-Line Carrier
Controlled Fluorescent Lighting," JRS Technology, Inc. $1,374,331 *
"High Temperature High Voltage Power Module Development,"
Custom Electronics Inc. $131,186 *
"Investigation of a Power Package Incorporating a Direct
Attached Ceramic/AlSiC Structure,"Brush Wellman Inc. $9,724
"Mitigation of Biofouling Using Hydrospark," Driscoll Brothers
& Comp., NYS Electric and Gas Corp. $49,000
"Thermal Conductivity of Copper Clad Ceramics," BrushWellman
Inc. $19,500
"Systems Engineering of Shared Resources," NASA Lewis Research
Center. $108,507
"High Density Shunt Regulator Development," Martin Marietta
Corporation. $49,119 *
"Self-Resonance Characterization for High Voltage Capacitors,"
Custom Electronics Inc. $40,000
"Cost Estimate for the ARM Electronic Circuit Cards," Lawrence
Livermore National Laboratory. $19,500
"Non-Contact Power Supply," Alabama Power Company. $9,500
"Materials Support for the Investigation of Charge Equalization
in Serial Batteries,"
NASA- Marshal Space Flight Center. $13,000
"Equalizing Converters for Serial Battery Charging," Auburn
University Solar-electric vehicle program. >$75K
"High Density Power Transformer," Unisys Corporation.
$9,750
Awards and Professional Activities:
Fellow - International Microelectronics and Packaging Society (IMAPS) 2007
Nominated Best Paper of Conference, IMAPS Int'l Symp. on Microelectronics, 2006
IEEE Region I "Outstanding Contributions to Education, Research and Professionalism," 2001
IEEE Third Millennium Medal Recipient, 1999;
Senior Member - International Microelectronics and Packaging Society (IMAPS), 1996;
Best Paper of Session, ISHM Int'l Symp. on Microelectronics, 1988, '89, '92, '94;
Who's Who in Science and Engineering, 1993;
Senior Member - Institute of Electrical and Electronics Engineers (IEEE), 1992;
Sigma Xi 1990;
Eta Kappa Nu 1987;
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